羅比芯科技Meet RobiChip · 洽談合作 POWER + AI + PHYSICAL EXECUTION
High-Power-Density Motor Drive Modules 高功率密度馬達驅動模組
Integrating power, control, thermal management, and system validation—from silicon to motion.
從晶片到實際運動，整合功率、控制、熱管理與系統驗證，建立可量產的 Physical AI 動力平台。
SEPTEMBER 04 · PROGRAM · 9 月 4 日議程
Technical and industry visitors meet RobiChip in the morning; the afternoon Venture Day invitation connects the system-level growth path with CVC and investors. Please arrive at least 20–30 minutes before your session.上午面向 SEMICON Taiwan 的技術與產業訪客；下午受邀參與 Venture Day，與 CVC 與投資人交流 RobiChip 的系統級成長路徑。請於演講前至少 20–30 分鐘抵達。
High-Power-Density Motor Drive Modules for Robotics and UAVs.面向機器人與 UAV 的高功率密度馬達驅動模組。
Silicon Startups Zone · Booth T9404 · 7F, TaiNEX 2 · English presentation · 英文演講Selected to present the semiconductor-defined motion opportunity and Design-in model to CVC and investor audiences.受邀向 CVC 與投資人介紹半導體定義運動的市場機會與 Design-in 模式。
Grand Hilai Taipei · 6F · invitation-only investor session · 邀請制投資人場次INVITATION-ONLY · NO PUBLIC REGISTRATIONOrganizer guidance: arrive at least 20–30 minutes before your session.
主辦方提醒：請於您的場次前至少 20–30 分鐘抵達。
VIRTUAL BOOTH · DEMONSTRATION FLOOR · 虛擬展間
Real scenes from the two TAIROS partner booths, the Swancor Inside physical panel, and the RobiChip × maxon film show the full thread from materials and motion to UAV propulsion validation.以 TAIROS 兩個合作展位的真實現場照片、Swancor Inside 實體 panel 與 RobiChip × maxon 聯合行銷影片，讓訪客看見從材料、動力到 UAV 推進驗證的完整脈絡。
RobiThrust bench results remain test-condition evidence—not endurance, qualification, or mass-production claims. Request a guided technical walk-through for the relevant application.
RobiThrust 的台架結果為特定測試條件下的證據，非耐久、認證或量產聲明；歡迎就應用需求預約技術導覽。
01 / THE OPPORTUNITY · 機會
Every upper-level AI decision must pass through a power-and-control layer before it becomes thrust or torque. That actuator-side layer is becoming a strategic semiconductor category.
AI 能看見、規劃與決策；真正創造價值的，是把決策轉化為安全、高效率且可靠的運動。
WHY THE MOTION STACK BREAKS · 動力堆疊為何失效
Separate optimization increases interfaces, BOM count, thermal handoffs, validation cycles, and process variability. The problem is architectural—not a search for one more component with a bigger headline rating.各自最佳化會增加介面、BOM 數量、熱傳遞交接、驗證週期與製程變異；真正的問題在於架構，而不是再尋找一顆規格更高的元件。
THE PLATFORM · 平台
A compact Power SoC architecture that connects control, three-phase GaN power, sensing, protection, and thermal design.緊湊的 Power SoC 架構，串連控制、三相 GaN 功率、感測、保護與熱設計。
Platform architecture design envelope
平台架構設計範圍
Compact module form factor
緊湊模組尺寸
Prototype testing range
原型測試範圍
Prototype output under documented test conditions
特定測試條件下的原型輸出
Target 1 kWArchitecture target pending engineering validation.
1 kW 為架構目標，仍待工程驗證。
Architecture targets and prototype results are stated separately. Final electrical limits and qualification specifications remain subject to engineering verification.
架構目標與原型結果分別呈現；最終電性極限與認證規格仍須經工程驗證。
ONE PLATFORM · MULTIPLE PROOF PATHS · 多重實證
Application data feeds the semiconductor, package, and thermal decisions—then returns as a more credible design-in.應用資料回饋半導體、封裝與熱設計決策，再形成更具說服力的 Design-in。
UAV propulsion evidence across thrust, efficiency, temperature, and motor–propeller matching.涵蓋推力、效率、溫度與馬達—螺旋槳匹配的 UAV 推進實測證據。
A robotics validation path for joints and actuators—presented as a roadmap, not an equivalent maturity claim.機器人關節與致動器的驗證路徑；此為產品路線圖，並非與 RobiThrust 相同成熟度的聲明。
Structured electrical, thermal, validation, and design-in decisions with engineering review at every gate.以工程審查為每一關卡把關，系統化支援電性、熱、驗證與 Design-in 決策。
MEASURED PROPULSION EVIDENCE · 推進實測證據
Bench and EVT results only—not endurance, qualification, or mass-production claims.
僅為台架與 EVT 結果，非耐久、認證或量產聲明。
COMMERCIALIZATION · NEXT-GEN UAV EVOLUTION · 商業化
RobiChip's UAV framework evolves through three layers—controller Design-in, motor–controller co-design, then a 3-in-1 high-thrust-density flight system. Each layer turns measured system evidence into a more deployable next-generation UAV platform.羅比芯的 UAV 框架分為三層：控制器 Design-in、馬達—控制器協同設計，以及三合一高推力密度飛行系統；每一層都將系統實測證據轉化為更可導入的次世代 UAV 平台。
Explore RobiThrust platform · 查看 RobiThrust 平台
GEN 1 → GEN 3
Gen 1 separates ESC, motor and propeller. Gen 2 starts to package components together. Gen 3 uses Power SoC as the high-thrust-density control core, joining power control, sensing, protection, thermal design, motor and propeller interfaces in a modular propulsion architecture.
從 ESC、馬達與螺旋槳分離的傳統架構，逐步走向整合模組；Gen 3 以 Power SoC 為高功率密度控制核心，將驅動、感測、保護、熱管理、馬達與螺旋槳介面串成模組化推進系統。
Concept architecture for Design-in discussion; final system specification depends on the application, motor and propeller configuration.Start with RobiSoC: define the control, power, thermal and validation envelope before the propulsion architecture is locked.從 RobiSoC 開始：在推進架構定版前，先界定控制、功率、熱與驗證邊界。
Match the motor, controller and system constraints with the relevant partner lane—then measure the resulting thrust, efficiency and heat.結合合作夥伴的馬達、控制器與系統條件，再量測實際推力、效率與熱表現。
Bring drive, motor and propeller interfaces together as a high-thrust-density RobiThrust flight-system validation path.將驅動、馬達與螺旋槳介面整合，形成高推力密度 RobiThrust 飛行系統的驗證路徑。
Convert the measured system evidence into DFM, EOL test, process windows, qualification planning and recurring Design-in value.將系統實測證據轉化為 DFM、EOL 測試、製程窗口、認證規劃與持續的 Design-in 價值。
SILICON TO HEAT PATH · 晶片至熱路徑
RobiChip connects power integration, thermal-domain separation, package-to-structure heat extraction, and field validation into one learning loop.羅比芯將功率整合、熱域分離、封裝至結構的熱萃取與現場驗證，串成單一的學習迴路。
A U.S. provisional application has been filed and the Taiwan counterpart is in application preparation. The public design principle is two complementary cooling paths: a thermally coupled conduction route from the heat source to the external heat-exchange interface, plus a guided-fluid convection route through engineered channels. In the UAV embodiment, propeller airflow can become part of that cooling architecture.美國臨時申請案已提出，台灣對應案正準備申請。公開的設計原則為兩條互補散熱路徑：由熱源至外部熱交換介面的熱耦合傳導路徑，以及透過工程化通道的導引流體對流路徑；在 UAV 應用中，螺旋槳氣流亦可成為冷卻架構的一部分。
Public summary only; Taiwan filing remains in preparation, and final implementation and claim scope remain subject to engineering and patent prosecution.Power SoC integration and thermal-aware component placement.
Power SoC 整合與熱感知元件配置。
Fewer interfaces across substrate, spreader, and system structure.
減少基板、均熱元件與系統結構間的介面。
Application data feeds package rules, test vehicles, and customer design-ins.
應用資料回饋封裝規則、測試載具與客戶 Design-in。
MEET US AT SEMICON TAIWAN · SEMICON Taiwan 洽談
September 2–3: partner booth meetings by appointment. Invite the RobiChip team to your booth for a focused collaboration discussion. September 4 is reserved for Silicon Startups Stage and the invitation-only Venture Day pitch.
9/2–9/3：可預約羅比芯親臨合作夥伴 Booth 洽談。減速機與運動元件夥伴，以及封裝、材料、設備與測試夥伴，皆可安排聚焦的合作討論；9/4 則為 Silicon Startups Stage 與邀請制 Venture Day Pitch。
Sep 2–3 · partner booth visits by appointment · 9/2–3 可預約拜訪合作夥伴 booth
Sep 4 · 11:20 Silicon Startups Stage · 14:30 Venture Day invitation-only investor session
9/4 · 11:20 矽創新舞台 · 14:30 邀請制 Venture Day 投資人場次