SEMICON TAIWAN · SEP 04 · 11:20–11:30
Silicon Startups StageSilicon Startups 新創舞台Top 40 · 前 40 強RobiChip was selected for the Silicon Startups Stage cohort, presenting Semiconductor-Defined Motion for robotics and UAV power systems.RobiChip 獲選 Silicon Startups Stage，發表面向機器人與無人機動力系統的 Semiconductor-Defined Motion。Official program · 官方議程
羅比芯科技Start a design-in · 開始導入 A NOTE TO OUR VISITORS · 致來賓
Thank you for joining RobiChip at SEMICON Taiwan 2026.感謝您蒞臨 RobiChip 於 SEMICON Taiwan 2026 的發表。
To everyone who visited the Silicon Startups Stage and the SEMI Venture Day Startup Pitch Showcase: thank you for the questions, technical exchange, and investment conversations. The exhibition has ended; the work now moves into Design-in.感謝每一位參與 Silicon Startups Stage 與 SEMI Venture Day Startup Pitch Showcase 的來賓。您提出的問題、技術交流與投資對話，讓我們更堅定地走向下一步：展覽已結束，工作正進入 Design-in 階段。
SEMICON TAIWAN 2026POST-SHOW REPORT · 展後報告
FROM COMPUTE TO MOTION · 從算力到動力
Semiconductor-Defined Motion半導體定義的動力
RobiSoC to Gen. 3 RobiThrustRobiSoC 至第三代 RobiThrust
SEMICON Taiwan confirmed the next motion layer: semiconductor architecture that turns compute into controllable torque and thrust.
從 RobiSoC 到 Gen. 3 RobiThrust，將算力轉為可控制的動力；整合功率、控制、熱管理與系統驗證。
POST-SHOW · SEMI RECOGNITION · 展後成果
Two stages. One motion thesis.兩個舞台，同一個動力主張。
More than an event archive, this is a public record of RobiChip advancing Semiconductor-Defined Motion from a technology thesis into industry, investment, and design-in conversations.這不只是展後活動紀錄，而是 RobiChip 將 Semiconductor-Defined Motion 從技術主張推進至產業、投資與 Design-in 對話的公開成果。
SEMI VENTURE DAY · SEP 04 · 14:30–14:40
Startup Pitch Showcase新創投資簡報會Top 10 · 前 10 強RobiChip was selected for the invitation-only Venture Day startup showcase, connecting the motion platform with strategic and investment audiences.RobiChip 獲選 invitation-only Venture Day 新創簡報會，將動力平台帶入策略合作與投資人對話。Official program · 官方議程WATCH · 觀看Silicon Startups Stage presentationSilicon Startups Stage 簡報↗READ · 閱讀Senior industry perspective on SEMICON Taiwan資深產業觀點：SEMICON Taiwan↗NEXT · 下一步Start a motion-system design-in啟動動力系統 Design-in↗
POST-SHOW NOTE · 展後註記
Technical claims remain tied to documented test conditions. The next objective is to turn qualified post-show conversations into application evidence, evaluation projects, and validated design-ins.技術主張仍以既有測試條件為準；下一步是將展後的有效對話轉化為應用實證、評估專案與通過驗證的 Design-in。
Begin a Design-in intake · 開始導入需求01 / THE ANNOUNCEMENT · 宣告
Compute decides.
RobiSoC makes it move.算力負責決策；RobiSoC 讓它化為動力。
The Semiconductor-Defined Motion era begins where AI decisions become safe, efficient, repeatable torque and thrust. RobiSoC is the semiconductor layer that connects control, power, sensing, protection, and the thermal path.
AI 負責看見、規劃與決策；RobiSoC 把算力轉為安全、高效率且可驗證的動力。
WHY THE MOTION STACK BREAKS · 為何動力堆疊失效
A good collection of components can still create a poor manufacturing system.即使元件各自優秀，仍可能形成不良的製造系統。
Separate optimization increases interfaces, BOM count, thermal handoffs, validation cycles, and process variability. The problem is architectural—not a search for one more component with a bigger headline rating.分別最佳化會增加介面、BOM、熱傳交接、驗證週期與製程變異。問題在架構，而非再找一個規格更大的單一元件。
TODAY · SEPARATED STACK · 現況：分離式堆疊Control控制Gate drive閘極驅動Power stage功率級Current sensing電流感測Protection保護機制Package / substrate封裝／基板Heat path / structure熱路徑／結構
ROBICHIPIntegrated power-driving platform整合式功率驅動平台
One package-level architecture from electronics to the heat path.從電子到熱路徑的一體化封裝架構。
- Lower BOM · 降低 BOM
- Fewer thermal interfaces · 減少熱介面
- Faster design-in evidence · 加速導入實證
THE PLATFORM · 平台
RobiSoC defines the motion stack.RobiSoC 定義動力堆疊。
A compact Power SoC architecture that connects control, three-phase GaN power, sensing, protection, and thermal design.緊湊型 Power SoC 架構，整合控制、三相 GaN 功率、感測、保護與熱設計。
Platform architecture design envelope平台架構設計範圍
Compact module form factor緊湊型模組尺寸
Prototype testing range原型測試電壓範圍
Prototype output under documented test conditions於文件化測試條件下的原型輸出
Architecture targets and prototype results are stated separately. Final electrical limits and qualification specifications remain subject to engineering verification.架構目標與原型結果分別陳述；最終電性極限與認證規格仍須經工程驗證。
ONE PLATFORM · MULTIPLE PROOF PATHS · 多元實證路徑
Evidence before claims.先有實證，再談主張。
Application data feeds the semiconductor, package, and thermal decisions—then returns as a more credible design-in.應用數據回饋至半導體、封裝與熱設計決策，進而形成更具說服力的 Design-in。
01
Measured now · 已完成實測RobiThrust
UAV propulsion evidence across thrust, efficiency, temperature, and motor–propeller matching.針對推力、效率、溫度與馬達－槳葉匹配完成無人機推進系統實證。
02
Planned path · 規劃驗證路徑RobiTorque
A robotics validation path for joints and actuators—presented as a roadmap, not an equivalent maturity claim.面向機器人關節與致動器的驗證路徑；此為產品路線圖，並非同等成熟度宣稱。
03
Workflow prototype · 工作流程原型RobiAgent
Structured electrical, thermal, validation, and design-in decisions with engineering review at every gate.以結構化流程整合電性、熱設計、驗證與 Design-in 決策，並於每個關卡進行工程審查。
ROBITHRUST · BENCH / EVT · 台架／工程驗證
GEN. 3 · SEMICONDUCTOR-DEFINED HIGH-THRUST SYSTEM · 第三代高推力系統
RobiThrust turns the stack into propulsion evidence.RobiThrust 將架構化為推進系統實證。
11.17gf/W average · 平均效率Light-UAV useful band · 輕型無人機有效區間
+6.3%vs. baseline · 相較基準70-A-class ESC comparison · 70A 級 ESC 比較
1.6 kgf@ 240 WPremium Type-I bench · Type-I 台架
47°Cmeasured T1 · 實測 T1Bench test condition · 台架測試條件
Bench and EVT results only—not endurance, qualification, or mass-production claims.僅為台架與工程驗證結果；不代表耐久、認證或量產宣稱。
Explore RobiThrust evidence · 查看 RobiThrust 實證COMMERCIALIZATION · 商業化
Design-in is the business model.Design-in 是商業模式。
Evaluation services create the entry point. A validated design-in creates recurring semiconductor and module value.評估服務創造導入入口；完成驗證的 Design-in 形成持續性的半導體與模組價值。
Evaluate評估
Generate measured use-case data with RobiDev and application validation.以 RobiDev 與應用驗證建立量測化的使用情境數據。
Co-develop共同開發
Lock electrical, thermal, control, package, and mechanical requirements.確認電性、熱、控制、封裝及機構需求。
Pilot試點導入
Prepare DFM, EOL test, process windows, and qualification planning.準備 DFM、EOL 測試、製程窗口及認證規劃。
Scale量產擴展
Capture recurring chip and module value through validated customer design-ins.藉由通過驗證的客戶 Design-in，建立持續性的晶片與模組價值。
DIGITAL DESIGN-IN INTAKE · 數位化導入需求
Bring the application, not a generic RFQ.帶著應用需求來，而不是一份制式 RFQ。
Start at dev.robichip.com with voltage, power, motor or actuator, thermal envelope, mechanical constraints, target timeline, and the evidence you need to de-risk.請於 dev.robichip.com 提供電壓、功率、馬達或致動器、熱環境、機構限制、目標時程，以及您希望降低風險的實證需求。
SILICON TO HEAT PATH · 從晶片到熱路徑
The moat is system architecture.競爭護城河是系統架構。
RobiChip connects power integration, thermal-domain separation, package-to-structure heat extraction, and field validation into one learning loop.RobiChip 將功率整合、熱域分離、封裝至結構的散熱，以及場域驗證串成單一學習迴路。
- 01Architecture架構
Power SoC integration and thermal-aware component placement.Power SoC 整合與熱感知元件佈局。
- 02Thermal path熱路徑
Fewer interfaces across substrate, spreader, and system structure.減少基板、擴散板與系統結構之間的介面。
- 03Execution loop執行迴路
Application data feeds package rules, test vehicles, and customer design-ins.應用數據回饋封裝規則、測試載具與客戶 Design-in。
AFTER SEMICON TAIWAN · SEMICON TAIWAN 展後
Turn post-show interest into a validated design-in.將展後興趣轉化為通過驗證的 Design-in。
We are now opening structured technical intake for robotics, UAV propulsion, motors, advanced packaging, manufacturing qualification, and pilot-system partners.我們現正開放機器人、無人機推進、馬達、先進封裝、製造認證與試點系統合作夥伴的結構化技術需求導入。
展後的下一步，是將技術交流導入明確的設計規格、評估計畫與 Design-in 驗證。
DESIGN-IN · NEXT STEP · 導入下一步DEV
Application intake · 應用需求導入
Evidence-led technical evaluation · 實證導向技術評估